Featured post

Top 5 books to refer for a VHDL beginner

VHDL (VHSIC-HDL, Very High-Speed Integrated Circuit Hardware Description Language) is a hardware description language used in electronic des...

Sunday, 19 August 2012

Asynchronous Integrated Circuits Design

Many modern integrated circuits are sequenced based on globally distributed periodic timing signals called clocks. This method of sequencing, synchronous, is prevalent and has contributed to the remarkable advancements in the semiconductor industry in form of chip density and speed in the last decades. For the trend to continue as proposed in Moore’s law, the number of transistors on a chip doubles about every two years, there are increasing requirements for enormous circuit complexity and transistor down scaling.

As the industry pursues these factors, many problems associated with switching delay, complexity management and clock distribution have placed limitation on the performance of synchronous system with an acceptable level of reliability. Consequently, the synchronous system design is challenged on foreseeable progress in device technology.

These concerns and other factors have caused resurgence in interest in the design of asynchronous or self-timed circuits that achieve sequencing without global clocks. Instead, synchronization among circuit elements is achieved through local handshakes based on generation and detection of request and acknowledgement signals.

Some notable advantages of asynchronous circuits over their synchronous counterparts are presented below:

* Average case performance. Synchronous circuits have to wait until all possible computations have completed before producing the results, thereby yielding the worst-case performance. In the asynchronous circuits, the system senses when computation has completed thereby enabling average case performance. For circuits like ripple carry adders with significantly worst-case delay than average-case delay, this can be an enormous saving in time.

* Design flexibility and cost reduction, with higher level logic design separated from lower timing design

* Separation of timing from functional correctness in certain types of asynchronous design styles thereby enabling insensitivity to delay variance in layout design, fabrication process, and operating environments.

* The asynchronous circuits consume less power than synchronous since signal transitions occur only in areas involved in current computation.

* The problem of clock skew evident in synchronous circuit is eliminated in the asynchronous circuit since there is no global clock to distribute. The clock skew, difference in arrival times of clock signal at different parts of the circuit, is one of the major problems in the synchronous design as feature size of transistors continues to decrease.

Asynchronous circuit design is not entirely new in theory and practice. It has been studied since the early 1940′s when the focus was mainly on mechanical relays and vacuum tube technologies. These studies resulted to two major theoretical models (Huffman and Muller models) in the 1950′s. Since then, the field of asynchronous circuits went through a number of high interest cycles with a huge amount of work accumulated. However, problems of switching hazards and ordering of operations encountered in early complex asynchronous circuits resulted to its replacement by synchronous circuits. Since then, the synchronous design has emerged as the prevalent design style with nearly all the third (and subsequent) generation computers based on synchronous system timing.

Despite the present unpopularity of the asynchronous circuits in the mainstream commercial chip production and some problems noted above, asynchronous design is an important research area. It promises at least with the combination of synchronous circuits to drive the next generation chip architecture that would achieve highly dependable, ultrahigh-performance computing in the 21st century.

The design of the asynchronous circuit follows the established hardware design flow, which involves in order: system specification, system design, circuit design, layout, verification, fabrication and testing though with major differences in concept. A notable one is the impractical nature of designing an asynchronous system based on ad-hoc fashion. With the use of clocks as in synchronous systems, lesser emphasis is placed on the dynamic state of the circuit whereas the asynchronous designer has to worry over hazard and ordering of operations. This makes it impossible to use the same design techniques applied in synchronous design to asynchronous design.

The design of asynchronous circuit begins with some assumption about gate and wire delay. It is very important that the chip designer examines and validates the assumption for the device technology, the fabrication process, and the operating environment that may impact on the system’s delay distribution throughout its lifetime. Based on this delay assumption, many theoretical models of asynchronous circuits have been identified.

There is the delay-insensitive model in which the correct operation of a circuit is independent of the delays in gates and in the wires connecting the gate, assuming that the delays are finite and positive. The speed-independent model developed by D.E. Muller assumes that gate delays are finite but unbounded, while there is no delay in wires. Another is the Huffman model, which assumes that the gate and wire delays are bounded and the upper bound is known.

For many practical circuit designs, these models are limited. For the examples in this discussion, quasi delay insensitive (QDI), which is a combination of the delay insensitive assumption and isochronic-fork assumption, is used. The latter is an assumption that the relative delay between two wires is less than the delay through a sequence of gates. It assumes that gates have arbitrary delay, and only makes relative timing assumptions on the propagation delay of some signals that fan-out to multiple gates.

Over the years, researchers have developed a method for the synthesis of asynchronous circuits whose correct functioning do not depend on the delays of gates and which permitted multiple concurrent switching signals. The VLSI computations are modeled using Communicating Hardware Processes (CHP) programs that describe their behavior algorithmically. The QDI circuits are synthesized from these programs using semantics-preserving transformations.

In conclusion, as the trend continues to build highly dependable, ultrahigh-performance computing in the 21st century, the asynchronous design promises to play a dominant role.

Thursday, 16 August 2012

Refreshing DDR SDRAM

dual-channel-ddr-sdram-800x800 Internally, computer memory is arranged as a matrix of "memory cells" in rows and columns, like the squares on a checkerboard, with each column being further divided by the I/O width of the memory chip. The entire organization of rows and columns is called a DRAM "array." For example, a 2Mx8 DRAM has roughly 2000 rows , 1000 columns, and 8 bits per column -- a total capacity of 16Mb, or 16 million bits.
Each memory cell is used to store a bit of data - stored as an electrical charge - which can be instantaneously retrieved by indicating the data's row and column location; however, DRAM is a volatile form of memory, which means that it must have power in order to retain data. When the power is turned off, data in RAM is lost.
DRAM is called "dynamic" RAM because it must be refreshed, or re-energized, hundreds of times each second in order to retain data. It has to be refreshed because its memory cells are designed around tiny capacitors that store electrical charges. These capacitors work like very tiny batteries and will gradually lose their stored charges if they are not re-energized. Also, the process of retrieving, or reading, data from the memory array tends to drain these charges, so the memory cells must be precharged before reading the data.
Refresh is the process of recharging, or re-energizing, the cells in a memory chip. Cells are refreshed one row at a time (usually one row per refresh cycle). The term "refresh rate" refers, not to the time it takes to refresh the memory, but to the total number of rows that it takes to refresh the entire DRAM array -- e.g. 2000 (2K) or 4000 (4K) rows. The term "refresh cycle" refers to the time it takes to refresh one row or, alternatively, to the time it takes to refresh the entire DRAM array. Refresh can be accomplished in many different ways, which is one of the reasons it can be a confusing topic.
Why are there different types of refresh? How are they different?
Refresh rate is determined by the total number of rows that have to be refreshed in a memory chip. Memory chips are designed for a particular type of refresh. For example, chips using 4K refresh will have about 4000 rows, which means that it will take about 4000 cycles to refresh the entire array. Chips using 2K refresh will have about 2000 rows, and chips with 1K refresh will have about 1000 rows. All of the chips in the chart below have the same total capacity* (16Mb, or 16 million cells), but different numbers of rows and columns depending on the type of refresh used.
4K refresh 2K refresh 1K refresh
4Mx4 4000 rows / 1000 columns 2000 rows / 2000 columns
2Mx8 4000 rows / 500 columns 2000 rows / 1000 columns
1Mx16 4000 rows / 250 columns 1000 rows / 1000 columns
* Capacity = rows x columns x width. For example, a 4Mx4 chip is 4 Megabits "deep" and 4 bits "wide" (Total = 16Mb). If this chip uses 4K refresh, it will be organized into 4000 rows x 1000 columns x 4 bits per column (Total = 16Mb). If this chip uses 2K refresh, it will be internally organized into 2000 rows x 2000 columns x 4 bits per column (Total = 16Mb). The capacity is the same, but the organization and refresh are different.
The major refresh rates in use today are 1K, 2K, 4K, and 8K. The primary reason for these different types of refresh is decreased power consumption. Since column address circuitry requires more power than row address circuitry, using a type of refresh that selects fewer columns per row draws less current -- e.g. 4K versus 2K.
In addition to various refresh rates, there are several different refresh methods. The two most basic methods are distributed and burst. Distributed refresh charges one row at a time, in sequential order. Burst refresh charges a whole group of rows in one burst.
Normally, the refresh operation is initiated by the system's memory controller, but some chips are designed for "self refresh." This means that the DRAM chip has its own refresh circuitry and does not require intervention from the CPU or external refresh circuitry. Self refresh dramatically reduces power consumption and is often used in portable computers.
Two other refresh techniques are hidden and extended refresh. Both of these techniques rely on capacitors (memory cells) that discharge more slowly. Hidden refresh combines the refresh operation with read/write operations. Extended refresh extends the length of time it takes to refresh the entire memory array. The advantage of both is that they do not have to refresh as often.
Why does 4K refresh consume less power than 2K refresh?
It seems logical to think that 4K refresh would consume more power than 2K refresh because the number is larger, but that is not the case. The numbers do not refer to the size of the refresh area but to the number of rows that it takes to refresh the entire DRAM. 2K refresh charges about 2000 rows to refresh a DRAM chip; 4K refresh charges twice as many rows. The tradeoff is that while 4K refresh takes longer, it consumes less power.
In actuality, 4K refresh charges a smaller section of the total array per cycle than 2K refresh. Looking at the chart above, you can see a 4Mx4 chip with 4K refresh charges about 1000 columns for every row, but the same chip with 2K refresh charges about 2000 columns for every row. Remember that column address circuitry requires more power than row address circuitry, so a refresh that charges fewer columns per row draws less current. 4K refresh charges fewer columns per row than 2K refresh and therefore uses less power -- about 1.2x less power.
Is the performance any different for one type of refresh versus another?
Performance differences are miniscule, but a 2K version of one DRAM chip will perform slightly better than a 4K version. The tradeoff between the number of rows and columns in the internal organization affects what is known as the "page depth" of the DRAM chip, which can impact particular applications. On the other hand, a 4K chip consumes much less power. Deciding which type of refresh to use depends on the specific system and application. These specifications are usually detailed by the system manufacturers.
Where are the different types of refresh used?
Most memory chips today use 1K or 2K refresh and can be found in the majority of PCs. At first, 4K refresh was used in portables, workstations, and PC servers because it consumes less power and generates less heat, but 4K refresh is also increasing in desktop PCs. 8K refresh is fairly new and is exclusive to 64Mb chips at present (mostly high-end applications).
Is memory with different refresh rates interchangeable?
The memory controller in your system determines the type of refresh it can support. Some controllers have only enough drivers to support 2K refresh (2000 rows). Others have been designed to support both types of refresh (2K and 4K) using a technique called "redundant addressing." Some support only 4K refresh. It all depends on the system itself.

Friday, 3 August 2012

SystemVerilog Interview Questions

1. What is clocking block?
2. What are modports?
3. What are interfaces?
4. What are virtual interfaces? How can it be used?
5. What is a class?
6. What is program block?
7. What is a mailbox?
8. What are semaphores?
9. Why is reactive scheduler used?
10. What are rand and randc?
11. What is the difference between keywords: rand and randc?
12. What is the use of always_ff?
13. What are static and automatic functions?
14. What is the procedure to assign elements in an array in systemverilog?
15. What are the types of arrays in systemverilog?
16. What are assertions?
17. What is the syntax for ## delay in assertion sequences?
18. What are virtual classes?
19. Why are assertions used?
20. Explain the difference between data type?s logic and reg and wire.
21. What is callback?
22. What are the ways to avoid race condition between testbench and RTL using SystemVerilog?
23. Explain event regions in systemverilog?
24. What are the types of coverages available in systemverilog?
25. How can you detect a deadlock condition in FSM?
26. What is mutex?
27. What is the significance of seed in randomization?
28. What is the difference between code coverage and functional coverage?
29. If the functional coverage is more that code coverage, what does it means?
30. How we can have #delay which is independent of time scale in system verilog?
31. What are constraints in systemverilog?
32. What are the different types of constraints in systemverilog?
33. What is an if-else constraint?
34. What is inheritance and give the basic syntax for it?
35. What is the difference between program block and module?
36. What is final block?
37. What are dynamic and associative arrays?
38. What is an abstract class?
39. What is the difference between $random and $urandom?
40. What is the use of $cast?
41. What is the difference between mailbox and queue?
42. What are bidirectional constraints?
43. What is circular dependency and how to avoid this problem?
44. What is the significance of super keyword?
45. What is the significance of this keyword?
46. What are input and output skews in clocking block?
47. What is a scoreboard?
48. Mention the purpose of dividing time slots in systemverilog?
49. What is static variable?
50. In simulation environment under what condition the simulation should end?
51. What is public declaration?
52. What is the use of local?
53. Difference b/w logic & bit.
54. How to take an asynchronous signal from clocking block?
55. What is fork-join, types and differences?
56. Difference between final and initial blocks?
57. What are the different layers in Testbench?
58. What is the use of modports?
59. What is the use of package?
60. What is the difference between bit [7:0] and byte?
61. What is chandle in systemverilog ?
62. What are the features added in systemverilog for function and task?
63. What is DPI in systemverilog?
64. What is inheritance?
65. What is polymorphism?
66. What is Encapsulation?
67. How to count number of elements in mailbox?
68. What is covergroup?
69. What are super, abstract and concrete classes?
70. Explain some coding guidelines you followed in your environment ?
71. What is Verification plan? What it contains?
72. Explain how messages are handled?
73. What is difference between define and parameter?
74. Why ?always? block not allowed inside program block?
75. How too implement clock in program block?
76. How to kill process in fork/join ?
77. Difference between Associative and dynamic arrays?
78. How to check whether randomization is successful or not?
79. What is property in SVA?
80. What advantages of Assertions?
81. What are immediate Assertions?
82. What are Assertion severity system level task? What happens if we won?t specify these tasks?
83. What is difference between Concurrent and Immediate assertions?
84. In which event region concurrent assertions will be evaluated?
85. What are the main components in Concurrent Assertions?
86. What is Consecutive Repetition Operator in SVA?
87. What is goto Replication operator in SVA?
88. What is difference between x [->4:7] and x [=4:7] in SVA?
89. What are implication operators in Assertions?
90. Can a constructor qualified as protected or local in systemverilog?
91. What are advantages of Interfaces?
92. How automatic variables are useful in Threads?

Get free daily email updates!
Follow us!

Monday, 30 July 2012

To 20nm and beyond: ARM targets Intel with TSMC collaboration

The multi-year deal sees ARM tie itself even closer to TSMC, its chip-fabber of choice, as it looks to capitalise on the company's technology to help it maintain a lead over Intel for chip power efficiency.

building-the-low-power-20nm-ecosystem ARM is ramping up its push to get its highly efficient low-power chips into servers by signing a multi-year agreement with Asian silicon manufacturer TSMC.
Under the deal, the Cambridge-based chip designer has agreed to share technical details with TSMC to help the fabricator make better chips with higher yields, ARM said on Monday. TSMC will also share information, so that ARM can create designs better suited to its manufacturing.

"By working closely with TSMC, we are able to leverage TSMC's ability to quickly ramp volume production of highly integrated SoCs [System-on-a-Chip processors] in advanced silicon process technology," Simon Segars, general manager for ARM's processor and physical IP divisions, said in a statement.

"The ongoing deep collaboration with TSMC provides customers earlier access to FinFET technology to bring high-performance, power-efficient products to market," he added.

The move should keep ARM's chip designs competitive with Intel's in the server market. TSMC's FinFET is akin to Intel's 3D 'tri-gate' method of designing processors with greater densities, which should deliver greater power efficiency and better performance from a cost point of view. 

By tweaking its chips to TSMC's process, ARM chips should deliver good yields on the silicon, keeping prices low while maintaining the higher power efficiency that comes with a lower process node.
ARM's chips dominate the mobile device market, but unlike Intel, it doesn't have a brand presence on the end devices. Instead, companies license its designs, go to a manufacturer, and rebrand the chips under their own name. You may not have heard of ARM, but the Apple, Qualcomm and Nvidia chips in mobile devices, as well as Calxeda and Marvell's server chips, are all based to some degree on based on ARM's low-power RISC-architecture processors.

64-bit processors

As part of the new deal, ARM is expecting to work with TSMC on 64-bit processors. It stressed how the 20nm process nodes provided by the fabber will make its server-targeted chips more efficient, potentially cutting datacentre electricity bills.

"This collaboration brings two industry leaders together earlier than ever before to optimise our FinFET process with ARM's 64-bit processors and physical IP," Cliff Hou, vice president of research and development for TSMC, said in the statement. "We can successfully achieve targets for high speed, low voltage and low leakage."

"We can successfully achieve targets for high speed, low voltage and low leakage" — Cliff Hou, TSMC

However, ARM only released its 64-bit chips in October, putting these at least a year and a half away from production, as licensees tweak designs to fit their devices. Right now, there are few ARM-based efforts pitched at the enterprise, aside from HP's Redstone Server Development platform and a try-before-you-buy ARM-based cloud for the OpenStack software.

Production processes

AMD, like ARM, does not operate its own chip fabrication facilities and so must depend on the facilities of others. AMD uses GlobalFoundries, while ARM licensees have tended to use TSMC. However, both TSMC and GlobalFoundries are a bit behind Intel in terms of the level of detail — the process node — they can make their chips to.
Right now, TSMC is still qualifying its 20nm process for certification by suppliers, while Intel has been shipping its 22nm Ivy Bridge processors for several months. Intel has claimed a product roadmap down to 14nm via use of its tri-gate 3D transistor technology, while TSMC is only saying in the ARM statement it will go beyond 20nm, without giving specifics.

Even with this partnership, Intel looks set to maintain its lead in advanced silicon manufacturing.
"By the time TSMC gets FinFET into production - earliest 2014, it's only just ramping 28nm [now] - Intel will be will into its 2nd generation FinFET buildout," Malcolm Penn, chief executive of semiconductor analysts Future Horizons, told ZDNet. This puts Intel "at least three years ahead of TSMC. Global Foundries will be even later."

Intel has noticed ARM's rise and has begun producing its own low-power server chips under the Centerton codename. However, these chips consume 6W compared with ARM's 5W.
At the time of writing, neither ARM nor TSMC had responded to requests for further information. Financial terms, if any, were not disclosed.

Tuesday, 24 July 2012

Editing your FPGA source

I noted that in a recent poll of FPGA developers, emacs was far and away the most popular VHDL and Verilog editor. There are a few reasons for this – namely, emacs comes with packages for editing your HDL of choice. For those of us not wanting to install (and learn) the emacs operating system, I got Notepad++ to work with these packages.

Notepad++ already has VHDL and Verilog highlighting along with other advanced text editor features, but I wanted templates, automated declarations and beautification. To do this, he used the FingerText to store code as snippets and call them up at the wave of a finger.

As I writes his code, the component declarations constantly need to be updated, and with the help of a Perl script I can update them with the click of a hotkey. Beautification is a harder nut to crack, as Notepad++ doesn’t even have a VHDL or Verilog beautifier plugin. This was accomplished by installing emacs and running the beautification process as a batch script. Nobody can have it all, but we’re thinking that this method of getting away from emacs is pretty neat.

Friday, 20 July 2012

VLSID 2013 - 26th International Conference on VLSI Design 2013

vlsi_2013Venue: Hyatt Regency, Pune, India

This joint conference is a forum for researchers and designers to present and discuss current topics in VLSI design, electronic design automation, embedded systems, and enabling technologies. Two days of tutorials will be followed by three days of regular paper sessions, special sessions, and embedded tutorials. Industry presentation sessions along with exhibits, panel discussions, Design Contest, and Education Forum round off the program.

The theme for the conference is Green Technology - A New Era for Electronics, which explores the ability of VLSI and embedded circuits and systems to positively impact the environment. Example areas under the theme include (but are not restricted to) designing energy-efficient VLSI circuits, improving the efficiency of energy-hungry applications such as data centers, developing intelligent monitoring and control systems such as smart grids, and using integrated circuits or embedded systems to leverage novel green technologies.

Pune city, also known as the Oxford of the East, has witnessed huge growth in its VLSI and embedded community over the past few years and is proud to host its very first VLSI Design Conference. The conference organizing committee is looking forward to making this an unforgettable experience for all attendees.

Conference Program:

Day 1

:

5th January 2013

:

Tutorial

Day 2

:

6th January 2013

:

Tutorial

Day 3

:

7th January 2013

:

Inaugural, Technical Sessions, Student

Day 4

:

8th January 2013

:

Valedictory/Award, Technical Sessions, Student Conference

Day 5

:

9th January 2013

:

Technical Sessions, RASDAT 2013 workshop

Day 6

:

10th January 2013

:

RASDAT 2013 workshop

Proposal submission links now available!
Papers, Tutorials, User/designer track submissions, Design contest and Embedded Tutorials, Special Sessions, Panels.
Deadline for Regular Paper submission has been extended to 24th July, 2012. Please submit Tutorial, User/designer track submissions, Design contest and Embedded Tutorials, Special sessions, Panels proposals by 2nd August, 2012.

Important Dates:

Paper Submissions

:

24th July, 2012

Tutorial Submissions

:

2nd August, 2012

User/Designer Submissions

:

2nd August, 2012

Call for embedded tutorials, special sessions, and panels

:

2nd August, 2012

Design Contest Submission

:

15th September, 2012

Acceptance of notification

:

7th September, 2012

Camera ready paper due

:

1st October, 2012

URL: http://www.vlsidesignconference.org/

Monday, 16 July 2012

MIT engineers Innovates an “Intelligent co-pilot” for cars

IT engineers have developed a semi-autonomous vehicle safety system that takes over if the driver does something stupid.

The system uses an onboard camera and laser rangefinder to identify hazards. An algorithm analyzes the data and identifies safe zones — avoiding, for example, barrels in a field, or other cars on a roadway.
The driver's in charge - until the system recognizes that the vehicle's about to exit a safe zone and takes over.

"The real innovation is enabling the car to share [control] with you," says PhD student Sterling Anderson. "If you want to drive, it’ll just make sure you don’t hit anything."

The team's approach is based on identifying safe zones, or 'homotopies', rather than specific paths of travel. Instead of mapping out individual paths along a roadway, the researchers divide a vehicle’s environment into triangles, with certain 'constrained' triangle edges representing an obstacle or a lane’s boundary.

If a driver looks like crossing a constrained edge — for instance, if he’s fallen asleep at the wheel and is about to run into a barrier  — the system takes over, steering the car back into the safe zone.

The system works well in tests, say its designers: in more than 1,200 trials of the system, with , there have only been a few collisions, mostly when glitches in the vehicle’s camera failed to identify an obstacle.

One possible problem with the system, though, is that it could give drivers a false sense of confidence on their own abilities.

Using it, says Anderson, "You’d say, ‘Hey, I pulled this off,’ and you wouldn’t know that the car is changing things behind the scenes to make sure the vehicle remains safe, even if your inputs are not."

He and Iagnemma are now exploring ways to tailor the system to various levels of driving experience.

They're also hoping to pare down the system to identify obstacles using a single cellphone.

"You could stick your cellphone on the dashboard, and it would use the camera, accelerometers and gyro to provide the feedback needed by the system," says Anderson.

"I think we'll find better ways of doing it that will be simpler, cheaper and allow more users access to the technology."